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【CallForPoster】2026高科技廠房設施R&D專區海報徵求

活動日期

2026/09/02~2026/09/04

活動地點

臺北南港展覽館2館4樓 4F, TaiNEX2

投稿方式

線上投稿

投稿開放日期

2026/04/01 ~ 2026/05/31

投稿費用

免費

主辦單位

台灣高科技廠房設施協會HTFA

協辦單位

台大高科技廠房設施研究中心HTFRC,NTU 台大氣候天氣災害研究中心WCDR,NTU

聯絡窗口

Contact 劉佳蓉Sophia sophialiu@htfa.org.tw

活動摘要

主題Theme:
以 AI 驅動創新加速高科技廠房設施的未來發展 Accelerating the Future of High-Tech Facilities Through AI-Driven Innovation

活動宗旨Purpose of the Event:
隨著半導體製程日益複雜與永續發展趨勢,人工智慧(AI)已成為廠房設施升級的核心動能。今年SEMICON Taiwan 高科技廠房設施R&D專區誠摯邀請學術研究界專家,針對如何運用 AI 技術優化廠房設計、提升能源效率、強化資安防護及達成減碳目標,分享最新研究成果與創新應用。

With the increasing complexity of semiconductor manufacturing processes and the global trend toward sustainability, Artificial Intelligence (AI) has become a key driving force for upgrading high-tech facility infrastructure. This year, the SEMICON Taiwan High-Tech Facility R&D Area sincerely invites experts from academia and research institutions to share their latest research findings and innovative applications. Topics include the use of AI technologies to optimize facility design, improve energy efficiency, enhance cybersecurity protection, and achieve carbon reduction goals.

徵稿範籌 Call for Posters Categories

* 智慧運營:AI 驅動的廠房運營與預測性維護。
* 數位轉型:數位孿生(Digital Twin)與GenAI在設施生命週期之應用。
* 淨零永續:AI 輔助之能耗分析、水資源管理、碳足跡追蹤、廢棄物減量與循環再用技術。
* 智慧防護:AI 在高科技設施資安(Cybersecurity)與職安之應用。

* Intelligent Operations: AI-Driven Facility Operations and Predictive Maintenance.
* Digital Transformation: Applications of Digital Twin and GenAI in Facility Lifecycle Management.
* Net-Zero Sustainability: AI-Assisted Energy Consumption Analysis, Water Resource Management, Carbon Footprint Tracking, Waste Reduction, and Circular Economy Technologies.
* Smart Protection: AI Applications in Cybersecurity and Occupational Safety for High-Tech Facilities.

重要日期Important Dates

 * 摘要投稿截止 Abstract Submission Deadline:May 31, 2026
 * 審查結果通知 Notification of Acceptance:June 15, 2026
 * 海報檔案提交 Poster Submission Deadline:July 20, 2026

入選海報之權益 Selected Poster Benefits

  1. 2026年高科技廠房設施國際論壇免費入場資格乙名 One complimentary pass to the High-Tech Facility International Forum 2026
  2. 學生投稿者另提供指導教授免費入場資格乙名 For student authors, an additional complimentary pass for their advisor
  3. 一趟高鐵來回車票補助 A round-trip High-Speed Rail ticket
  4. 學生投稿者可獲海報發表獎助金 For student authors, a poster presentation scholarship

現場發表說明 On-site Presentation

  • 發表地點:台北南港展覽館2館 — SEMICON Taiwan 高科技廠房設施 R&D 專區攤位。
  • 解說時間:2026年9月2日至9月4日期間1天,具體時段由主辦單位安排後另行通知。
  • Location: SEMICON Taiwan, TaiNEX 2, High-Tech Facility Academic R&D Area Booth.
  • Schedule: One day during the period of September 2 – September 4, 2026; specific time slot to be determined.
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