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【徵求稿件】從 AI 到落地:高科技廠房智慧營運與最佳實務

活動日期

2026/12/18

活動地點

大臺南會展中心3樓熱蘭遮A廳(臺南市歸仁區歸仁十二路3號)

報名方式

線上報名|Online Registration

報名開放日期

2026/09/15 ~ 2026/10/30

報名費用

免費

主辦單位

台灣高科技廠房設施協會 | HTFA

聯絡窗口

秘書處何珮琳(Peggy),peggyho@htfa.org.tw

活動摘要

本次論壇以「從 AI 到落地」為主軸,聚焦高科技廠房智慧營運的實際應用與最佳實務,邀請晶圓製造、半導體供應鏈、設備商、系統整合商、工程顧問、學研單位及技術服務夥伴,共同分享智慧廠務建置經驗、創新技術應用、跨領域合作成果及實際導入案例。
除了期待高科技廠房設施供應鍊夥伴的參與,我們也特別鼓勵來自業主端(Fab Owner)的實務經驗分享,包括智慧廠務管理、設備與設施最佳化、數位轉型推動、跨部門協作、維運策略,以及導入 AI 或智慧系統後所帶來的效益與挑戰,共同促進產業交流與經驗傳承。
誠摯邀請高科技廠房生態系各領域專家踴躍投稿,共同探討智慧營運的新模式,攜手打造更高效率、更高可靠度、更具韌性的下一世代高科技廠房。

Themed "From AI to Implementation," this forum focuses on the practical applications and best practices of smart operations in high-tech facilities. We invite experts from wafer manufacturing, semiconductor supply chains, equipment suppliers, system integrators, engineering consultants, academic and research institutions, and technical service partners to share their experiences in smart facility construction, innovative technology applications, cross-disciplinary collaborations, and real-world deployment cases.

In addition to anticipating the participation of our high-tech facility supply chain partners, we particularly encourage practical experience sharing from Fab Owners. Topics of interest include smart facility management, equipment and facility optimization, digital transformation initiatives, cross-departmental collaboration, operation and maintenance (O&M) strategies, and the benefits and challenges of deploying AI or smart systems, collectively fostering industry exchange and knowledge transfer.

We sincerely invite experts across the high-tech facility ecosystem to submit papers and actively participate. Let us explore new models of smart operations together and collaborate in building the next generation of high-tech facilities characterized by higher efficiency, greater reliability, and stronger resilience.

投稿簡報格式模板(請統一使用)| Slide Template

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